Surface Mount Technology Ceramic Antenna

　　Surface Mount Technology (SMT) Ceramic Antennas: An Efficient Integration Solution for Electronic Devices

　　In the era of miniaturization and automation in electronics manufacturing, production efficiency, space utilization, and signal reliability directly impact product competitiveness. Our SMT ceramic antennas redefine antenna integration. Utilizing high-purity ceramic dielectric and precision SMT packaging, they address the core pain points of traditional through-hole antennas (e.g., inefficient manual assembly, large PCB footprint, and poor soldering consistency), while delivering superior RF performance, making them a top choice for consumer electronics, IoT modules, and industrial equipment.

　　Core Technology Features: A perfect combination of SMT advantages and high performance

　　1. Seamless SMT Production Compatibility: Improves Manufacturing Efficiency

　　Standard SMT Process Compatibility: Compatible with mainstream SMT production lines (e.g., Yamaha, Juki, and Fuji placement machines) and reflow soldering profiles (peak temperature 240-260°C, compliant with IPC/JEDEC J-STD-020), eliminating the need for manual insertion.

　　High Soldering Reliability: Palladium-silver (Pd-Ag) terminal electrodes (thickness ≥ 15μm) combined with the excellent thermal stability of ceramic ensure solder joint shear strength ≥ 5N (tested according to IPC-TM-650 2.4.13), reducing post-soldering failure rate to <0.1%.

　　Improved Efficiency: Antenna assembly time is reduced by 40% compared to through-hole antennas; supporting mass production of over 10,000 units per hour, it is ideal for high-volume devices (such as TWS earphones and smart sensors).

　　2. Ultra-Miniature Design: Maximizes PCB space utilization

　　Compact Form Factor: Offers ultra-small dimensions:

　　2.4GHz band: 4mm × 4mm × 1.0mm (smallest version), 50% smaller than traditional SMT antennas of comparable performance.

　　Multi-band (2.4GHz + GNSS): 6mm × 4mm × 1.2mm – suitable for ultra-thin devices (such as 3mm-thick smartwatch PCBs and miniature IoT sensor housings).

　　Thin Profile: Typical height ≤ 1.5mm (customizable down to 0.8mm for ultra-thin devices), avoiding interference with other components (e.g., batteries, microchips) and enabling slim product designs.

　　Space Saving: Compared to through-hole antennas, it occupies 35% less PCB area, freeing up space for other features (e.g., larger batteries, more sensors) in compact devices.

　　3. Excellent RF Performance: Stable Signal Transmission

　　Low Dielectric Loss and High Q:

　　Using high-purity alumina ceramic (Al₂O₃, purity ≥96%), with a dielectric constant εr = 9.8 ± 0.5 (25°C) and a dielectric loss tanδ ≤ 0.0006 (10GHz), this ensures minimal signal attenuation.

　　The high Q (≥500 at 2.4GHz) enhances signal selectivity and reduces interference from adjacent frequencies (e.g., Bluetooth and Wi-Fi).

　　Consistent Impedance Matching: 50Ω standard impedance and a voltage standing wave ratio (VSWR) ≤1.5 across the entire operating frequency band (tested according to ANSI C63.4) minimize signal reflections and energy waste.

　　Multi-band Support: Covers key frequency bands used by electronic devices:

　　2.4GHz (2.402-2.484GHz): Suitable for Bluetooth 5.3, Wi-Fi 4/5, and Zigbee.

　　GNSS (GPS L1: 1575.42MHz, GLONASS G3: 1602MHz): Suitable for smart wearables and outdoor trackers.

　　Sub-1GHz (868MHz/915MHz): Suitable for LoRa/NB-IoT IoT sensors (customizable).

　　4. Strong Environmental Adaptability: Reliable Operation in Various Scenarios

　　Wide Temperature Range: Stable operation from -40°C to +85°C (extended range for industrial applications: -55°C to +125°C), with no performance drift in extreme cold environments (e.g., outdoor sensors in winter) and high temperatures (e.g., automotive equipment).

　　Moisture and Corrosion Resistance: The terminal electrodes are plated with nickel-gold (Ni-Au) (thickness ≥ 5μm) and can withstand 500 hours of salt spray testing (compliant with ISO 9227), making them suitable for humid environments (e.g., smart bathroom devices and marine IoT modules).

　　Mechanical Durability: Withstands over 1000 cycles of thermal shock (-40°C to +85°C, 30 minutes each) and vibration (10-2000Hz, 10g acceleration, compliant with IEC 60068-2-6), ensuring long-term reliability in portable devices.

　　5. Easy Integration and Design Flexibility

　　No External Matching Components Required: The integrated RF matching circuit (LC network) eliminates the need for additional inductors/capacitors, simplifies PCB layout, and reduces BOM costs by 15%.

　　Multiple Mounting Options: Supports top-mount and side-mount configurations to accommodate diverse PCB layout requirements (e.g., edge-mounting for TWS earphones, center-mounting for smartwatch modules).

　　Design Support: 3D CAD models (STEP/IGES formats) and PCB layout guidelines (e.g., ground plane dimensions, component clearances) are provided to accelerate customer product development cycles.

　　Application Scenario: Enabling a variety of electronic devices

　　Consumer Electronics:

　　TWS earphones: The 2.4GHz SMT antenna (4mm×4mm×1.0mm) enables stable Bluetooth connectivity and easily fits into slim earphone housings.

　　Smartwatches: The multi-band (2.4GHz+GNSS) model (6mm×4mm×1.2mm) supports fitness tracking and location-based services while maintaining a slim design.

　　Smart Home Devices: Sub-1GHz SMT Antenna for Smart Homesswitches/sensors, ensuring long-range connectivity in large homes.

　　IoT Modules:

　　Low-power IoT Sensors: 868MHz SMT antenna (5mm×3mm×1.0mm) with ultra-low power consumption, ideal for battery-powered environmental monitors.

　　Industrial IoT (IIoT): Extended-temperature SMT antenna (-55℃ to +125℃) for factory sensors, withstanding harsh production environments.

　　Automotive Electronics:

　　In-Car Infotainment: 2.4GHz/5GHz dual-band SMT antenna (8mm×5mm×1.2mm) supports Wi-Fi/Bluetooth, integrating into compact infotainment PCBs.

　　Telematics Modules: GNSS SMT antenna with high gain (4dBi), ensuring accurate vehicle location tracking.